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SPC5777CAK3MME3

Part No SPC5777CAK3MME3
Manufacturer NXP / Nexperia
Catalog Embedded - Microcontrollers
Description IC MCU 32BIT 8MB FLASH 416MAPBGA / e200z7 series Microcontroller IC 32-Bit Tri-Core 264MHz 8MB (8M x 8) FLASH 416-MAPBGA (27x27)
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr NXP USA Inc.
Series MPC57xx
Core Processor e200z7
Core Size 32-Bit Tri-Core
Speed 264MHz
Connectivity EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire
Program Memory Size 8MB (8M x 8)
Program Memory Type FLASH
RAM Size 512K x 8
Supply Voltage - Operating 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 125°C (TA)
Mounting SMD (SMT)
Package / Case 416-BGA
Supplier Device Package 416-MAPBGA (27x27)
Base Product Number SPC5777
Other Names 935350944557
Standard Package 40
MSL Level 3 (168 Hours)
ECCN 5A002A1
HTSUS 8542.31.0001
Win Source Part Number 1263862-SPC5777CAK3MME3
Ultra Librarian 3D Model Ultra Librarian SPC5777CAK3MME3 CAD Model

Description

The SPC5777CAK3MME3 is a state-of-the-art microcontroller unit (MCU) from NXP Semiconductors, designed to meet the rigorous demands of automotive and industrial applications. This powerful MCU is part of the MPC57xx family, which is renowned for its high performance, reliability, and a wide range of integrated features.

Key Features

  • Core: The SPC5777CAK3MME3 is built on a 32-bit Power Architecture® with a dual-core configuration, ensuring efficient processing and multitasking capabilities.
  • Memory: It boasts an impressive memory architecture that includes 4 MB of flash memory and 256 KB of RAM, providing ample space for complex applications and data storage.
  • Frequency: The MCU operates at a frequency of up to 264 MHz, delivering robust performance for compute-intensive tasks.
  • Connectivity: A variety of communication interfaces are supported, including Ethernet, FlexRay, and multiple CAN (Controller Area Network) modules, facilitating versatile connectivity options for different system designs.
  • Security: Enhanced security features are integrated to protect against unauthorized access and ensure data integrity, which is crucial for automotive safety and industrial control systems.
  • Temperature Range: The device is designed to operate reliably across a wide temperature range, making it suitable for harsh environments.

Applications

The SPC5777CAK3MME3 MCU is ideal for a variety of applications, particularly within the automotive sector. It is well-suited for advanced driver-assistance systems (ADAS), engine management systems, body control modules, and gateway applications. Additionally, its robust feature set makes it applicable for industrial automation, where precision and reliability are paramount.

Quality and Reliability

NXP Semiconductors is committed to delivering high-quality products, and the SPC5777CAK3MME3 is no exception. It is designed to meet the stringent quality standards required in automotive and industrial markets, ensuring long-term reliability and performance.

Support and Resources

Developers can access a wealth of resources, including technical documentation, development tools, and software support, to facilitate the design and implementation of systems using the SPC5777CAK3MME3 MCU.

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