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Category Integrated Circuits (ICs) - Power Management (PMIC) - Motor Drivers, Controllers
Mfr onsemi
Series Motion-SPM®8
Package Tube
Product Status Obsolete
Motor Type - Stepper Multiphase
Motor Type - AC, DC Brushless DC (BLDC)
Function Driver - Fully Integrated, Control and Power Stage
Output Configuration Half Bridge
Interface Logic
Technology IGBT
Step Resolution -
Applications General Purpose
Current - Output 4A
Voltage - Supply 450V
Voltage - Load -
Temperature Range - Operating -40°C ~ 150°C (TJ)
Mounting Type Through Hole
Package / Case 25-PowerDIP Module (0.815", 20.70mm)
Supplier Device Package SPMFA-A25
Base Product Number FNB80460
MSL Level Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Win Source Part Number 1355674-FNB80460T3
Ultra Librarian 3D Model Ultra Librarian FNB80460T3 CAD Model

Description

ON Semiconductor FNB80460T3 Intelligent Power Module

The FNB80460T3 from ON Semiconductor is a cutting-edge Intelligent Power Module (IPM) that has been engineered to deliver high-performance power conversion in a compact package. This module is an ideal choice for a wide range of applications, including motor drives, power inverters, and other power-intensive applications that require efficient and reliable operation.

At the heart of the FNB80460T3 lies a three-phase IGBT inverter bridge configured with advanced Insulated Gate Bipolar Transistors (IGBTs) and freewheeling diodes. These components are optimized for low conduction and switching losses, which translates to enhanced overall efficiency and thermal performance. The module is capable of handling a continuous current of up to 10A and boasts a maximum rating of 600V, making it suitable for mid-power level applications.

The FNB80460T3 is designed with integrated features that simplify system design and enhance functionality. It includes built-in under-voltage lockout and over-temperature protection circuits, which safeguard the module against adverse operating conditions. The inclusion of a thermistor for temperature monitoring allows for precise thermal management, ensuring the longevity and reliability of the module.

ON Semiconductor has packaged the FNB80460T3 in a highly thermally efficient DIP package. This design minimizes the thermal resistance between the module and the heatsink, further improving the thermal characteristics of the device. The package is also compact, which allows designers to reduce the footprint of their power conversion systems without sacrificing performance.

In summary, the FNB80460T3 is a robust and intelligent solution for designers looking to enhance the efficiency and reliability of their power systems. With its integrated protection features, high-performance IGBTs, and compact, thermally optimized design, this power module from ON Semiconductor stands out as a top-tier choice for a myriad of power applications.

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Pricing & Ordering

Quantity Unit Price Ext. Price
5+ $14.8324 $74.1620
11+ $12.1701 $133.8711
17+ $11.7899 $200.4283
23+ $11.4096 $262.4208
30+ $11.0292 $330.8760
40+ $9.8883 $395.5320
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 30 pieces
MOQ: 5 pcs
Order Increment : 1 piece
*Need More Quantity? *Request a Bulk Quantity Quotation?

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