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BALF-SPI2-01D3

Part No BALF-SPI2-01D3
Manufacturer STMicroelectronics
Catalog Balun
Description BALUN 868MHZ-928MHZ 50/50 6UFBGA
Sample
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ECAD Module
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Products specifications Report Issue?

Category RF and Wireless - Balun
Mfr STMicroelectronics
Package Tape & Reel
Product Status Active
Frequency Range 868MHz ~ 928MHz
Impedance - Unbalanced/Balanced 50 / 50Ohm
Phase Difference
Insertion Loss (Max) 2.1dB
Return Loss (Min) 10dB
Package / Case 6-UFBGA, FCBGA
Mounting Type Surface Mount
Base Product Number BALF
Standard Package 5,000 pcs
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Win Source Part Number 852196-BALF-SPI2-01D3
Ultra Librarian 3D Model Ultra Librarian BALF-SPI2-01D3 CAD Model

Description

The BALF-SPI2-01D3 is a high-performance, integrated RF balun from STMicroelectronics designed for wireless communication applications. This compact component is engineered to simplify PCB design and enhance signal performance for systems operating in the 2.4 GHz ISM band. It is a perfect solution for applications requiring efficient RF front-end circuitry, such as Bluetooth, ZigBee, and Wi-Fi connectivity.

Key Features

  • Frequency Range: Specifically designed to operate within the 2.4 GHz ISM band, making it ideal for a wide range of wireless communication protocols.
  • Low Insertion Loss: The BALF-SPI2-01D3 boasts a low insertion loss, which ensures minimal signal attenuation for a robust and reliable wireless connection.
  • High Return Loss: With a high return loss, this balun provides better impedance matching, which translates to reduced signal reflections and improved overall performance.
  • Integrated Matching Network: The inclusion of an integrated matching network simplifies the design process, reducing the need for additional external components and saving valuable board space.
  • Small Form Factor: The compact size of the BALF-SPI2-01D3 allows for its use in space-constrained applications, making it a versatile choice for a variety of wireless systems.

Applications

The BALF-SPI2-01D3 is suitable for a range of applications that require reliable RF communication. Its primary uses include:

  • Bluetooth-enabled devices
  • ZigBee-based home automation and smart energy systems
  • Wi-Fi modules for IoT devices
  • Wireless sensor networks
  • Portable consumer electronics

Advantages

Integrating the BALF-SPI2-01D3 into your design offers several advantages:

  • Enhanced signal integrity due to optimized balun design
  • Reduced time-to-market with simplified design and fewer external components
  • Improved system reliability with consistent performance across the specified frequency range
  • Space-saving footprint that accommodates compact designs without compromising on functionality

With its combination of performance, integration, and compact size, the BALF-SPI2-01D3 from STMicroelectronics is an excellent choice for designers looking to optimize their RF wireless systems.

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Pricing & Ordering

Quantity Unit Price Ext. Price
110+ $0.4565 $50.2150
270+ $0.3746 $101.1420
415+ $0.3629 $150.6035
570+ $0.3512 $200.1840
740+ $0.3395 $251.2300
990+ $0.3043 $301.2570
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 10,000 pieces
MOQ: 110 pcs
Order Increment : 1 pcs
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