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CXK5864CM-10LL

Part No CXK5864CM-10LL
Manufacturer Sony
Catalog OEM Parts (C - E)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1053977-CXK5864CM-10LL
Categories OEM Parts(C-E)
Manufacturer Sony
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian CXK5864CM-10LL CAD Model

Description

The CXK5864CM-10LL is a static random-access memory (SRAM) chip manufactured by Sony. SRAM is favored for its speed and ease of use in various electronic applications. The '10LL' likely denotes a very fast access time, possibly around 10 nanoseconds. This makes it well-suited for applications requiring rapid data storage and retrieval.

Applications

  • Cache memory in microprocessors: Enhancing performance by providing quick access to frequently used data.
  • Embedded systems: Storing configuration data and variables.
  • Digital signal processing (DSP): Buffering and processing signals in real-time.
  • Communication equipment: Managing data flow in network devices.
  • Industrial control systems: Storing and updating process control parameters.

Features

  • 64 Kbit (8KB) Memory Capacity: Suitable for applications with moderate memory requirements.
  • Fast Access Time (10ns): Enables high-speed data transfers.
  • Low Power Consumption: Extends battery life in portable devices.
  • Static Operation: Eliminates the need for refresh cycles, simplifying memory management.
  • CMOS Technology: Offers low power dissipation and high noise immunity.

Benefits

  • Increased System Performance: Fast access times improve overall system responsiveness.
  • Reduced Power Consumption: Minimizes energy usage and heat generation.
  • Simplified System Design: Static operation simplifies memory interfacing and reduces complexity.
  • Enhanced Reliability: CMOS technology provides stable and reliable operation.
  • Compact Size: Allows for integration into space-constrained applications.

Further specifications for the CXK5864CM-10LL would include its operating voltage, temperature range, package type (e.g., DIP, SOIC), and specific power consumption data. These details are crucial for proper system integration and performance optimization.

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