The ASP-200920-03 is a high-performance array socket from Samtec Inc., designed for board-to-board connections in demanding applications. This socket is part of Samtec's ASP Series, known for its rugged construction and reliable signal integrity.

Applications

• High-speed data transmission systems
• Telecommunications equipment
• Industrial automation
• Medical devices
• Aerospace and defense applications
• Board-to-board stacking

Features

• High-density array design
• Durable construction for rugged environments
• Optimized for signal integrity
• Available in various stack heights
• RoHS compliant
• Gold-plated contacts for reliable connections

Benefits

• Enables high-speed data transfer with minimal signal loss
• Provides a robust and reliable connection in harsh environments
• Offers design flexibility with various stack height options
• Reduces board space requirements due to its high-density design
• Ensures long-term reliability and performance

Additional Details

The ASP-200920-03 features a specific pin count and arrangement designed for optimal performance. The gold-plated contacts ensure excellent conductivity and resistance to corrosion, contributing to the long-term reliability of the connection. The rugged construction of the socket makes it suitable for use in environments with vibration and shock. Samtec's ASP series is well-regarded for its quality and performance in demanding applications where signal integrity is crucial. The specific stack height can be determined from Samtec's product documentation, allowing designers to choose the appropriate height for their board-to-board stacking requirements. It is designed to minimize impedance discontinuities, reducing signal reflections and ensuring clean signal transmission. This connector is often used with Samtec's mating connectors to create a complete board-to-board interconnect solution.