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Same model may have multiple batches, images only for reference.
BR25G256FVT-3GE2 Real Image
Same model may have multiple batches, images only for reference.

BR25G256FVT-3GE2

Part No BR25G256FVT-3GE2
Manufacturer Rohm Semiconductor
Catalog Memory
Description IC EEPROM 256KBIT SPI 8TSSOP
Datasheet
BR25G256FVT-3GE2 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Memory
Mfr Rohm Semiconductor
Package Tape & Reel
Product Status Active
Programmable Not Verified
Memory Type Non-Volatile
Memory Format EEPROM
Technology EEPROM
Memory Size 256Kbit
Memory Organization 32K x 8
Memory Interface SPI
Clock Frequency 20 MHz
Write Cycle Time - Word, Page 5ms
Voltage - Supply 1.6V ~ 5.5V
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 8-TSSOP-B
Base Product Number BR25G256
Standard Package 3,000 pcs
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0051
Win Source Part Number 571770-BR25G256FVT-3GE2
Ultra Librarian 3D Model Ultra Librarian BR25G256FVT-3GE2 CAD Model

Description

The BR25G256FVT-3GE2 is a memory integrated circuit (IC) with a capacity of 256Kbit.

  • Technology: Non-volatile EEPROM
  • Voltage Supply Range: 1.6V to 5.5V
  • Package Type: 8-TSSOP
  • Packaging: Tape & Reel
  • Supplier Device Package: 8-TSSOP-B
  • Operating Temperature Range: -40°C to 85°C
  • Memory Interface: SPI
  • Clock Frequency: 20 MHz
  • Write Cycle Time: 5ms
  • ECCN: EAR99
  • REACH: Not affected
  • MSL Level: 1 (Unlimited)
  • HTSUS Code: 8542.32.0051
  • Base Product Number: BR25G256
  • Status: Active

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Availability: 5,300 pieces
MOQ: 23 pcs
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