The PCA9513ADP is a sophisticated integrated circuit designed by NXP Semiconductors, tailored for applications that require robust I2C or SMBus signal buffering. This device is particularly suitable for systems that demand hot swap capabilities, allowing for the connection or disconnection of I2C-bus or SMBus devices while the power is on without causing glitches or disruptions on the bus.

Key Features

• Active High Repeater Enable: The PCA9513ADP features an active high repeater enable input that allows the user to control the repeater function, providing flexibility in managing the I2C-bus or SMBus communication.
• Hot Swap Capability: With its hot swap feature, this bus buffer ensures that the insertion or removal of I2C-bus or SMBus devices does not corrupt the data flow on the bus.
• Low Standby Current: The low standby current is a hallmark of the PCA9513ADP, making it an energy-efficient choice for power-sensitive applications.
• Level Shifting: The device can also be used for level shifting between different voltage domains, allowing for communication between devices operating at different voltages.
• No Glitch on Power-up: The PCA9513ADP is designed to prevent glitches on the bus during power-up, ensuring a stable start-up for connected devices.
• Lock-up Free Operation: A unique feature of the PCA9513ADP is its ability to prevent bus lock-up, which can occur when devices become disconnected during operation.

Applications

The PCA9513ADP is ideal for a variety of applications that require reliable I2C-bus or SMBus communications. It is commonly used in:

• Server motherboards
• Rack-based data centers
• Telecommunications equipment
• Industrial control systems

Technical Specifications

The PCA9513ADP operates over a supply voltage range of 2.3V to 3.6V and is available in a TSSOP8 package. Its operating temperature range spans from -40°C to +85°C, making it suitable for industrial environments.

Ordering and Packaging

The NXP PCA9513ADP is sold under the orderable part number PCA9513ADP,118, and it comes in a TSSOP8 package that is both compact and suitable for automated assembly processes, ensuring ease of integration into a wide range of products.