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Categories Integrated Circuits (ICs)
Manufacturer NXP
Packaging Reel package
Applications System Basis Chip
Interface CAN
Operating Supply Voltage 5V
Package 28-SOIC (0.295", 7.50mm Width)
Manufacturer Package 28-SOIC
Mounting SMD
Win Source Part Number 787756-MC33889BPEGR2
Popularity Medium
Supply and Demand Status Limited
Family Name MC33889
Introduction Date December 15, 2012
ECCN EAR99
Country of Origin United States of America
Halogen Free Compliant
Estimated EOL Date 2026
Ultra Librarian 3D Model Ultra Librarian MC33889BPEGR2 CAD Model

Description

The MC33889BPEGR2 is a sophisticated System Basis Chip (SBC) from NXP Semiconductors, designed to support the demanding requirements of automotive applications. This integrated circuit is engineered to provide a secure and efficient interface between the vehicle's microcontroller and its various peripherals, enhancing the overall system reliability and performance.

Key Features

  • High-Voltage Capability: The device is capable of handling high-voltage conditions, which is crucial for automotive power systems.
  • Multiple Communication Channels: It includes a CAN (Controller Area Network) transceiver for robust vehicle communication.
  • Enhanced Power Management: The SBC provides various power control and monitoring functions, including a 5V voltage regulator with a dedicated watchdog timer to ensure system stability.
  • Fail-Safe Operation: It has fail-safe features like undervoltage detection and overtemperature protection, ensuring the safety of the automotive electronic system.

Applications

The MC33889BPEGR2 is primarily used in automotive environments, serving a wide range of applications such as:

  • Body Control Modules
  • Powertrain Systems
  • Advanced Driver Assistance Systems (ADAS)
  • Infotainment Systems

Technical Specifications

The device boasts a robust set of technical specifications that make it suitable for the automotive industry's stringent requirements:

  • Supply Voltage Range: 5.5V to 27V
  • Operating Temperature Range: -40°C to 125°C, suitable for harsh environments
  • Package: 32-lead SOIC wide body, providing a compact footprint for space-constrained applications

Quality and Reliability

NXP's MC33889BPEGR2 is designed with a commitment to quality and reliability, meeting the automotive industry's high standards. It is AEC-Q100 qualified, ensuring that it can withstand the rigors of automotive operation, from thermal stress to vibration and shock resistance.

For developers and engineers seeking a reliable system basis chip that can handle the complexities of modern automotive electronics, the MC33889BPEGR2 by NXP Semiconductors is an excellent choice that offers both performance and peace of mind.

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