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XC7Z030-1FBG676C

Part No XC7Z030-1FBG676C
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 676FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Xilinx Inc.
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM Cortex -A9 MPCore with CoreSight
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex -7 FPGA, 125K Logic Cells
Temperature Range - Operating 0°C ~ 85°C
Manufacturer Package 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Part Number Series XC7Z030
Manufacturer Pack Quantity 1
MSL Level 4 (72 Hours)
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 810860-XC7Z030-1FBG676C
Ultra Librarian 3D Model Ultra Librarian XC7Z030-1FBG676C CAD Model

Description

The Xilinx Inc. XC7Z030-1FBG676C is a medium-popularity integrated circuit (IC).

  • FPGA Family: Kintex-7
  • Logic Cells: 125K
  • Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight, 667MHz
  • I/O Pins: 130
  • RAM Size: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Supplier Device Package: 676-FCBGA (27x27)
  • Mounting Type: Surface Mount
  • MSL Level: 4 (72 Hours)
  • RoHS: Compliant
  • Manufacturer Pack Quantity: 1

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $170.1389 $170.1389
2+ $163.3333 $326.6666
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Availability: 800 pieces
Order Increment : 1 pcs
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