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808-AG11D-ESL-LF

Part No 808-AG11D-ESL-LF
Manufacturer TE Connectivity
Catalog Sockets for ICs, Transistors
Description CONN IC DIP SOCKET 8POS GOLD / 8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Sample
Rohs State rohs
ECAD Module
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Category Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets
Mfr TE Connectivity AMP Connectors
Series 800
Package Tube
Product Status Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 8 (2 x 4)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating Flash
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post Flash
Contact Material - Post Copper
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT) , Polyester
Temperature Range - Operating -55°C ~ 105°C
Termination Post Length 0.125" (3.18mm)
Material Flammability Rating UL94 V-0
Contact Resistance 10mOhm
Base Product Number 808
Standard Package 60
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Win Source Part Number 1339593-808-AG11D-ESL-LF
Ultra Librarian 3D Model Ultra Librarian 808-AG11D-ESL-LF CAD Model

Description

The 1339593-808-AG11D-ESL-LF by TE Connectivity AMP Connectors is an IC socket with a DIP, 0.3" (7.62mm) row spacing.

  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Contact Material - Post: Copper
  • Number of Positions or Pins (Grid): 8
  • Rows Spacing: 2 x 4
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Material Flammability Rating: UL94 V-0
  • Termination: Solder
  • Mounting Type: Through Hole
  • Operating Temperature: -55°C ~ 105°C
  • Contact Resistance: 10mOhm
  • MSL: 1 (Unlimited)
  • REACH Status: REACH Unaffected
  • HTSUS: 8536.69.4040

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