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XR2A-1411-N

Part No XR2A-1411-N
Manufacturer Omron
Catalog Sockets for ICs, Transistors
Description CONN IC DIP SOCKET 14POS GOLD / 14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets
Mfr Omron Electronics Inc-EMC Div
Series XR2
Package Tube
Product Status Active
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 14 (2 x 7)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Material - Post Beryllium Copper
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Temperature Range - Operating -55°C ~ 125°C
Termination Post Length 0.126" (3.20mm)
Material Flammability Rating UL94 V-0
Current Rating (Amps) 1 A
Contact Resistance 20mOhm
Base Product Number XR2A
MSL Level 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Win Source Part Number 1363456-XR2A-1411-N
Ultra Librarian 3D Model Ultra Librarian XR2A-1411-N CAD Model

Description

The XR2A-1411-N is a DIP socket for ICs and transistors from Omron Electronics Inc-EMC Div.

  • Manufacturer: Omron Electronics Inc-EMC Div
  • Product Number: XR2A-1411-N
  • Series: XR2
  • Base Product Number: XR2A
  • Current Rating: 1A
  • Contact Finish: Gold
  • Contact Finish Thickness: 10.0μin (0.25μm)
  • Design: Open Frame
  • Number of Positions: 14
  • Row Spacing: 0.3" (7.62mm)
  • Pitch (Mating): 0.100" (2.54mm)
  • Pitch (Post): 0.100" (2.54mm)
  • Termination: Solder
  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Mounting Type: Through Hole

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