This specification covers the requirements for application of DDR4 Dual In–Line Memory Module (DIMM) Sockets–Solder Tail for main memory applications in networking equipment. The sockets are available in a 288–position with contact spacing on 0.80 mm centerlines (0.80mm pitch). The sockets are designed to connect processor modules (daughterboard) to printed circuit (pc) boards (motherboard). The socket consists of a polarized housing containing pre–installed through hole contacts. Each contact is a solid one–piece construction with a tapered lead–in solder tine. The socket features module support towers and extractors designed to support and hold the module in the mated position, and a card slot which contains a molded–in voltage key and function key to ensure polarization with the mating daughterboard (which must be slotted to accept the keys). The socket features boardlocks to provide retention for the socket during soldering or alignment posts to aid in pc board alignment during mating. The socket also features standoffs and molded–in circuit identification on the mating face. The sockets are designed for manual placement on the pc board.