The ST25DV04K-JFR8D3 is a dynamic NFC/RFID tag IC with a dual interface from the renowned semiconductor manufacturer STMicroelectronics. This product offers a unique combination of flexibility, power, and convenience, making it an ideal choice for a wide range of applications in various industries such as consumer electronics, healthcare, and industrial automation.
Key Features
- Memory Size: The device comes with a 4 Kbits EEPROM, enabling sufficient data storage for common use cases in NFC applications.
- Fast Data Transfer: It supports fast data transfer rates with an I2C interface up to 1 Mbit/s and an RF interface up to 53 Kbit/s in NFC mode.
- Dual Interface: The ST25DV04K-JFR8D3 features both an I2C serial interface and an ISO/IEC 15693 RF interface, allowing easy and flexible integration into different system designs.
- Energy Harvesting: An innovative energy harvesting feature enables the device to power external components from the harvested RF energy, reducing the overall power consumption of the system.
- Security: The product includes multiple security features such as password protection and a unique 64-bit serial number for each device, enhancing data protection and preventing unauthorized access.
- Multiple Block Protection: Users can protect blocks individually, offering a tailored security approach for sensitive data.
- Wide Temperature Range: The tag IC operates across a wide temperature range from -40°C to 85°C, ensuring reliable performance under varying environmental conditions.
Potential Applications
The ST25DV04K-JFR8D3 is versatile and can be used in a multitude of applications, including:
- Consumer electronics for device pairing and parameter settings
- Smart posters for advertising and information sharing
- Medical devices for tracking and patient data management
- Industrial automation for product authentication and maintenance records
With its robust feature set, the ST25DV04K-JFR8D3 is designed to meet the needs of developers looking for a high-performance NFC/RFID solution. Its compact form factor and ease of integration make it a go-to choice for smart connectivity and data transfer applications.
