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IMX185LQJ-C

Part No IMX185LQJ-C
Manufacturer Sony
Catalog Hard To Find
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Reference Date Code 16+
Reference case CLCC
Manufacturer Sony
Win Source Part Number 718653-IMX185LQJ-C
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian IMX185LQJ-C CAD Model

Description

The Sony IMX185LQJ-C is a high-sensitivity, high-resolution CMOS image sensor designed for a variety of applications requiring exceptional image quality in low-light conditions. This sensor is part of Sony's renowned line of image sensors, known for their advanced pixel technology and superior performance.

Applications

  • Security cameras
  • Surveillance systems
  • Industrial inspection cameras
  • Medical imaging devices
  • Scientific imaging

Features

  • High sensitivity
  • High resolution
  • CMOS technology
  • Low dark current
  • Electronic rolling shutter
  • Built-in analog-to-digital converter (ADC)

Benefits

  • Exceptional image quality in low-light conditions
  • Detailed and clear images due to high resolution
  • Reduced noise and improved dynamic range
  • Fast image capture
  • Easy integration into various imaging systems

Additional Details

The IMX185LQJ-C features a large pixel size, enabling it to capture more light and produce images with high signal-to-noise ratio. The CMOS technology offers low power consumption and high-speed readout capabilities. The sensor's electronic rolling shutter allows for progressive scanning, minimizing distortion in moving objects. The built-in ADC converts the analog signal from the pixels into a digital signal, simplifying the image processing pipeline. Specific parameters, such as the sensor size, resolution, pixel size, and frame rate, should be confirmed from the official Sony datasheet for the IMX185LQJ-C. Proper lens selection and image processing techniques are crucial for maximizing the sensor's performance. The sensor's high sensitivity and resolution make it an ideal choice for applications requiring clear and detailed images in challenging lighting conditions. The sensor is typically packaged as a BGA (Ball Grid Array) component for efficient surface mount assembly. Careful consideration of thermal management is important during system design to ensure optimal sensor performance and longevity.

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Pricing & Ordering

Quantity Unit Price Ext. Price
2+ $32.0150 $64.0300
4+ $26.2687 $105.0748
6+ $25.4478 $152.6868
9+ $24.6269 $221.6421
11+ $23.8060 $261.8660
15+ $21.3433 $320.1495
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 1,136 pieces
MOQ: 2 pcs
Order Increment : 1 pcs
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Shipping Information

Shipped from HK warehouse
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