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SMS-113-01-G-D

Part No SMS-113-01-G-D
Manufacturer Samtec Inc.
Catalog Rectangular Connectors
Description CONN SOCKET STRIP 1.27MM 26POS
Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Connectors, Interconnects
Manufacturer Samtec Inc.
Packaging Tube/Rail
Status Active
Connector Type Receptacle
Contact Type Forked
Style Board to Board
Number of Positions 26
Number of Positions Loaded All
Pitch - Mating 0.050" (1.27mm)
Number of Rows 2
Row Spacing - Mating 0.100" (2.54mm)
Mounting Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10μin (0.25μm)
Insulation Color Black
Insulation Height 0.335" (8.51mm)
Contact Length - Post 0.100" (2.54mm)
Temperature Range - Operating -55°C to 125°C
Contact Finish - Post Gold
Current Rating 5A per Contact
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Finish Thickness - Post 3μin (0.08μm)
Win Source Part Number 1098627-SMS-113-01-G-D
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian SMS-113-01-G-D CAD Model

Description

The SMS-113-01-G-D is a 26-position, board-to-board interconnect from Samtec Inc.

  • Positions: 26
  • Type: Board-to-Board Interconnect
  • Fastening Type: Push-Pull
  • Mounting Style: Through-Hole
  • Pitch-Mating: 0.050” (1.27mm)
  • Row Spacing: 0.100” (2.54mm)
  • Voltage Rating: -
  • Current Rating: 5A per contact
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Insulation Color: Black
  • Contact Finish-Mating: Gold
  • Contact Finish-Post: Gold
  • Status: Active
  • Popularity: Medium
  • Supply and Demand Status: Balanced

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Pricing & Ordering

Quantity Unit Price Ext. Price
19+ $3.1086 $59.0634
46+ $2.5506 $117.3276
71+ $2.4709 $175.4339
97+ $2.3912 $231.9464
125+ $2.3115 $288.9375
168+ $2.0725 $348.1800
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 5,100 pieces
MOQ: 19 pcs
Order Increment : 1 pcs
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Shipping Information

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