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Category Integrated Circuits (ICs)>Specialized ICs
Mfr NXP Semiconductors
Package Bulk
Product Status Obsolete
Type Distributed System Interface (DSI)
Mounting SMD (SMT)
Package / Case 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC
RoHS Status RoHS non-compliant
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8542.39.0001
Other Names 2156-MC33790HEGR2
Standard Package 1
Win Source Part Number 1077248-MC33790HEGR2
Ultra Librarian 3D Model Ultra Librarian MC33790HEGR2 CAD Model

Description

Product Overview: MC33790HEGR2 by NXP Semiconductors

The MC33790HEGR2 is a cutting-edge Serial Peripheral Interface (SPI) Slave Device designed and manufactured by NXP Semiconductors, a leader in the automotive and secure connectivity solutions. This device is specifically engineered to provide a robust and efficient interface for automotive and industrial applications where reliable data communication is crucial.

Key Features

  • Robust Communication: The MC33790HEGR2 is designed with a differential serial bus interface that ensures high immunity to electromagnetic interference, which is particularly important in harsh automotive environments.
  • High-Speed SPI Interface: With its SPI compatibility, this device can easily integrate with a host microcontroller for seamless data exchange, ensuring swift and reliable communication.
  • Low Power Consumption: Tailored for energy-efficient operation, the MC33790HEGR2 is ideal for applications that require minimal power draw without compromising performance.
  • Enhanced Safety Features: It includes built-in fail-safe mechanisms such as short-circuit and over-temperature protection, which contribute to the overall safety and durability of the system.
  • Wide Operating Temperature Range: The device is capable of operating over a broad temperature range, making it suitable for various challenging conditions.

Applications

The MC33790HEGR2 is versatile and can be used in a variety of applications, including:

  • Automotive control systems, such as engine control units, body control modules, and advanced driver-assistance systems (ADAS).
  • Industrial automation systems that require reliable data transmission.
  • Medical equipment where precision and reliability are paramount.
  • Any system requiring a robust SPI communication interface under stringent conditions.

Product Specifications

The MC33790HEGR2 is available in a surface-mount package, which allows for compact and efficient PCB design. It is designed to meet the rigorous standards of the automotive industry, ensuring both quality and reliability. The device supports a wide range of power supply voltages and is characterized by low quiescent current, contributing to its energy efficiency.

With its combination of high-speed communication, robustness, and safety features, the MC33790HEGR2 from NXP Semiconductors is a premier choice for designers looking to enhance the reliability and performance of their automotive or industrial systems.

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Pricing & Ordering

Quantity Unit Price Ext. Price
8+ $7.1714 $57.3712
20+ $5.8843 $117.6860
30+ $5.7004 $171.0120
41+ $5.5164 $226.1724
53+ $5.3325 $282.6225
71+ $4.7809 $339.4439
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 7,470 pieces
MOQ: 8 pcs
Order Increment : 1 piece
*Need More Quantity? *Request a Bulk Quantity Quotation?

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