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74AUP1G09GM

Part No 74AUP1G09GM
Manufacturer NXP / Nexperia
Catalog Hard To Find
Description Low-power 2-input AND gate with open-drain
Sample
Rohs State rohs
ECAD Module
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Manufacturer NXP
Win Source Part Number 1131034-74AUP1G09GM
Manufacturer Homepage www.nxp.com
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian 74AUP1G09GM CAD Model

Description

Overview of NXP 74AUP1G09GM

The NXP 74AUP1G09GM is a high-performance, low-power single 2-input AND gate with open-drain output, belonging to the advanced ultra-low power (AUP) family. This integrated circuit is designed for exceptional power efficiency, making it an ideal choice for battery-operated and power-sensitive applications.

Key Features

  • Low Static Power Consumption: The 74AUP1G09GM boasts a very low static power consumption, with an ICC of only 0.9 μA max. This makes it an excellent solution for energy-saving requirements.
  • Wide Supply Voltage Range: It operates over a wide supply voltage range from 0.8V to 3.6V, which allows for flexible use in various circuit designs and compatibility with other logic levels.
  • High Noise Immunity: The device is equipped with a high noise immunity, characterized by a VCC of 1.2V to 3.6V.
  • Low Noise Overshoot and Undershoot: This IC is designed to minimize noise overshoot and undershoot, which ensures signal integrity in high-speed switching environments.
  • ESD Protection: The 74AUP1G09GM provides excellent electrostatic discharge (ESD) protection, with HBM JESD22-A114E exceeding 2000V and MM JESD22-A115-A exceeding 200V.

Applications

Due to its low-power characteristics and high noise immunity, the NXP 74AUP1G09GM is suitable for a wide range of applications, including:

  • Smartphones, tablets, and wearable technology
  • Portable medical devices
  • Energy management systems
  • Microcontroller interfacing
  • Battery-powered devices

Package Information

The 74AUP1G09GM comes in a very small and leadless XSON6 package, which is an ideal choice for space-constrained applications. The package size is only 1.0mm x 1.45mm, with a height of 0.5mm, making it suitable for compact PCB layouts.

This product underscores NXP's commitment to providing innovative, low-power, and high-performance solutions for the ever-evolving demands of modern electronic devices.

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Pricing & Ordering

Quantity Unit Price Ext. Price
695+ $0.0722 $50.1790
1,690+ $0.0593 $100.2170
2,615+ $0.0574 $150.1010
3,600+ $0.0556 $200.1600
4,660+ $0.0537 $250.2420
6,225+ $0.0482 $300.0450
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 10,000 pieces
MOQ: 695 pcs
Order Increment : 1 pcs
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