The MT47H64M16HR-3L:H is a DDR2 SDRAM component from Micron Technology Inc. designed for use in applications needing high-speed memory access and a balance between performance and power consumption. These applications include embedded systems, graphics cards, and general computing.
Applications
- Embedded systems
- Graphics cards
- General computing
- Networking equipment
- Gaming consoles
Features
- DDR2 SDRAM: Utilizes DDR2 technology, offering improved data transfer rates compared to DDR SDRAM.
- Capacity: 64 Meg x 16 configuration, providing a total capacity of 1 Gigabit (1024 Mbits).
- Speed Grade: -3L indicates a data transfer rate potentially up to 667 Mbps (DDR2-667), but further verification from the datasheet is needed. The 'L' suggests a lower power variant.
- Operating Voltage: Operates at 1.8V, standard for DDR2, providing a balance between performance and power.
- Interface: Standard DDR2 interface for easy integration with compatible memory controllers.
- Package: Typically available in FBGA (Fine-pitch Ball Grid Array) package for efficient board mounting and thermal management.
Benefits
- High Bandwidth: DDR2 technology enables high-speed data transfer, which enhances overall system performance.
- Low Latency: Designed for low latency operation, ensuring fast data access and improved system responsiveness.
- Power Efficiency: The 1.8V operating voltage contributes to reduced power consumption, making it suitable for power-sensitive applications.
- Reliability: Micron's manufacturing processes ensure high reliability and long-term stability.
- Compatibility: Adheres to JEDEC standards for DDR2 SDRAM, facilitating compatibility with a wide range of systems.
Additional Details
The MT47H64M16HR-3L:H is optimized for applications requiring a balance of speed, capacity, and power efficiency. The '-3L' designation suggests a lower power variant, which is beneficial for mobile and embedded systems. The ':H' likely denotes internal production tracking information. Consult the Micron datasheet for definitive specifications, including timing parameters, power consumption details, and package information.
This memory component is suitable for use in devices that require relatively high memory capacity and bandwidth while also prioritizing low power consumption. Its DDR2 compliance allows for ease of integration in different system designs.