The ATTINY816-MF from Microchip Technology is a high-performance, picoPower 8-bit AVR RISC-based microcontroller that combines 8KB ISP flash memory, 512-Byte EEPROM, 2KB SRAM, and a wealth of versatile peripherals. This microcontroller is designed for efficiency and flexibility, making it an ideal choice for a wide range of applications, from industrial control systems to consumer electronics.

Key Features

• Advanced RISC Architecture: With 131 powerful instructions, most of which are executed in a single clock cycle, the ATTINY816-MF offers a perfect blend of power, speed, and efficiency.
• Memory: Features 8KB of in-system self-programmable flash, 512 bytes of EEPROM for data storage, and 2KB SRAM, ensuring ample space for complex applications.
• Peripherals: Includes a variety of peripherals such as a 10-bit Analog-to-Digital Converter (ADC), Analog Comparator, Zero Cross Detector, multiple communication interfaces (SPI, I2C, USART), and custom programmable logic blocks.
• picoPower Technology: Microchip's picoPower technology ensures the microcontroller is suitable for power-sensitive designs, offering various power-saving modes.
• Configurable Custom Logic (CCL): Unique to the TinyAVR series, this feature allows users to combine peripherals and I/O pins to create custom hardware-based functions, without using additional components.
• Versatile Power Supply Options: Operating between 1.8V to 5.5V, the device can be powered by a range of supply sources, making it adaptable to both battery-powered and powered applications.

Applications

The ATTINY816-MF is a versatile microcontroller that can be deployed in various applications including, but not limited to, home automation, consumer electronics, automotive, sensor control systems, and power management solutions. Its small form factor, combined with its powerful feature set, makes it an excellent choice for space-constrained applications requiring low power consumption and high performance.

Package Information

The ATTINY816-MF is available in a 20-pin QFN package, offering a compact footprint for space-sensitive designs. The package also provides enhanced thermal performance and reduced lead inductance, making it suitable for high-speed and high-frequency applications.