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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 44 Weeks
Manufacturer Intel
Series MAX® II
Package Tray
Number of I/O 160
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 256-BGA
Case / Package 256-FBGA (17x17)
Family Name EPM570
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Part Number 974612, -544-1295, 544-1295, EPM570F256C4-ND
Quantity per package 90
Popularity High
Supply and Demand Status Balance
Win Source Part Number 918447-EPM570F256C4
Ultra Librarian 3D Model Ultra Librarian EPM570F256C4 CAD Model

Description

The Intel EPM570F256C4 is a high-performance MAX® II series FPGA IC.

  • I/O: 160
  • Mounting: Surface mountable
  • Operating Temperature Range: 0°C to 85°C (TJ)
  • Package: 256-BGA
  • Mounting: Tray-mounted
  • Supply and Demand Status: Balanced
  • MSL Level: 3 (168 hours)
  • REACH: Unaffected
  • ECCN: 3A991D
  • Units per package: 90
  • Estimated production lead time: 44 weeks
  • Other part numbers: 974612, -544-1295, 544-1295, and EPM570F256C4-ND

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Pricing & Ordering

Quantity Unit Price Ext. Price
3+ $28.0284 $84.0852
6+ $22.9976 $137.9856
9+ $22.2797 $200.5173
12+ $21.5604 $258.7248
16+ $20.8425 $333.4800
21+ $18.6861 $392.4081
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 12,500 pieces
MOQ: 3 pcs
Order Increment : 1 piece
*Need More Quantity? *Request a Bulk Quantity Quotation?
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