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IDT72T18115L10BB

Part No IDT72T18115L10BB
Manufacturer IDT, Integrated Device Technology Inc
Catalog Logic - FIFOs Memory
Description 2.5 VOLT HIGH-SPEED TeraSync FIFO 18-BIT/9-BIT CONFIGURATIONS
Sample
Rohs State rohs
ECAD Module
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Manufacturer IDT, Integrated Device Technology Inc
Win Source Part Number 1184779-IDT72T18115L10BB
Manufacturer Homepage www.idt.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian IDT72T18115L10BB CAD Model

Description

The IDT72T18115L10BB is a high-speed, synchronous FIFO (First-In, First-Out) memory device manufactured by Integrated Device Technology (IDT). It's designed for critical applications requiring extremely fast data buffering and rate matching. This FIFO is a solution for managing data flow in high-performance communication, networking, and signal processing systems.

Applications

  • Data Communications
  • Networking (routers, switches)
  • Digital Signal Processing (DSP)
  • High-Speed Data Acquisition
  • Telecommunications Equipment
  • Medical Imaging

Features

  • Very High-Speed Operation: 10ns access time.
  • Synchronous Operation: Data transfer synchronized to a clock signal.
  • Deep FIFO: Large data storage capacity for buffering bursts of data.
  • Byte-Wide Organization: Supports byte-wide data transfers.
  • Output Enable Control: Facilitates data bus management and prevents bus contention.
  • Empty and Full Flags: Indicate when the FIFO is empty or full to prevent data errors.
  • Programmable Flags: Allow customization of flag behavior.
  • Available in BGA Package: Enables high-density board designs.

Benefits

  • Improves system performance by buffering data between asynchronous devices.
  • Handles high-speed data rates in demanding applications.
  • Simplifies system design.
  • Reduces system cost by minimizing external logic requirements.
  • Enhances system reliability by preventing data loss due to underflow or overflow.

Additional Details

The IDT72T18115L10BB operates from a 3.3V power supply. The synchronous nature of the device simplifies timing and control. The byte-wide organization aligns with standard data handling practices. The device's full, empty, and programmable flags provide flexible system control. The BGA (Ball Grid Array) package enables high-density mounting and improved signal integrity. This FIFO is often found in applications where extremely high-speed data transfer and deep buffering are mandatory. It's utilized in communication systems, high-performance computing platforms, and telecommunications infrastructure to manage data streams effectively.

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