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Same model may have multiple batches, images only for reference.
MPC885ZP66 Real Image
Same model may have multiple batches, images only for reference.

MPC885ZP66

Part No MPC885ZP66
Manufacturer Freescale Semiconductor - NXP
Catalog Embedded - Microprocessors
Description IC MPU MPC8XX 66MHZ 357BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - Microprocessors
Mfr Freescale Semiconductor - NXP
Series MPC8xx
Package Bulk
Product Status Active
Core Processor MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 66MHz
Co-Processors/DSP Communications; CPM, Security; SEC
RAM Controllers DRAM
Graphics Acceleration No
Ethernet 10Mbps (3), 10/100Mbps (2)
USB USB 2.0 (1)
Voltage - I/O 3.3V
Temperature Range - Operating 0°C ~ 95°C (TA)
Security Features Cryptography
Mounting Type Surface Mount
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Base Product Number MPC88
Standard Package 1 pcs
MSL Level 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 5A002A1 FRE
HTSUS 8542.31.0001
Win Source Part Number 643779-MPC885ZP66
Ultra Librarian 3D Model Ultra Librarian MPC885ZP66 CAD Model

Description

The MPC885ZP66 is a microprocessor designed for embedded applications.

  • Category: Integrated Circuits (ICs)
  • Sub-Category: Embedded - Microprocessors
  • Series: MPC8xx
  • Core Processor: MPC8xx
  • Number of Cores: 1
  • Bus Width: 32-bit
  • Speed: 66MHz
  • Co-processors/DSPs: Communications and Security
  • RAM Controllers: DRAM
  • Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, and UART/USART
  • Voltage Supply: 3.3V
  • Temperature Range: 0°C to 95°C
  • Mounting Type: Surface Mount
  • Package: 357-BBGA
  • Manufacturer: Freescale Semiconductor - NXP
  • Status: Active

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Quantity Unit Price Ext. Price
1+ $69.7377 $69.7377
3+ $57.2210 $171.6630
4+ $55.4331 $221.7324
5+ $53.6440 $268.2200
6+ $51.8560 $311.1360
8+ $46.4922 $371.9376
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