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Same model may have multiple batches, images only for reference.
CYUSB2014-BZXC Real Image
Same model may have multiple batches, images only for reference.

CYUSB2014-BZXC

Part No CYUSB2014-BZXC
Manufacturer Cypress Semiconductor Corp
Catalog Embedded - Microcontrollers - Application Specific
Description IC EZ-USB BRIDGE FX3 3.0 121BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 46 Weeks
Manufacturer Cypress Semiconductor Corp
Series EZ-USB FX3™
Package Tray
Core Processor ARM9®
Number of I/O 59
Program Memory Type External Program Memory
Operating Temperature Range 0°C ~ 70°C
Mounting Surface Mount
Package 121-TFBGA
Case / Package 121-FBGA (10x10)
Family Name CYUSB2014
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.39.0001
Other Part Number -CYUSB2014-BZXC, 2266-CYUSB2014-BZXC
Quantity per package 840
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 844418-CYUSB2014-BZXC
Ultra Librarian 3D Model Ultra Librarian CYUSB2014-BZXC CAD Model

Description

The EZ-USB FX3™ CYUSB2014-BZXC is an integrated circuit (IC) from the Cypress Semiconductor Corp.

  • Core Processor: ARM9®
  • Operating Temperature Range: 0°C ~ 70°C
  • Package: 121-TFBGA
  • Mounting Type: surface mount
  • Number of I/O: 59
  • Program Memory Type: external program memory
  • Supply and Demand Status: limited
  • Estimated Production Lead Time: 46 weeks

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9+ $11.7647 $105.8823
14+ $11.3971 $159.5594
19+ $11.0294 $209.5586
24+ $10.6618 $255.8832
32+ $9.5588 $305.8816
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