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CY7C1414KV250BZC

Part No CY7C1414KV250BZC
Manufacturer Cypress Semiconductor Corp
Catalog OEM Parts (C - E)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1054260-CY7C1414KV250BZC
Categories OEM Parts(C-E)
Manufacturer Cypress Semiconductor Corp
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian CY7C1414KV250BZC CAD Model

Description

The CY7C1414KV250BZC is a high-speed synchronous Static RAM (SRAM) device manufactured by Cypress Semiconductor. It is organized as 4Mb (128K x 36) and designed for applications requiring high bandwidth and low latency. This SRAM operates at a supply voltage of 2.5V and is optimized for high-performance systems.

Applications:

  • Networking equipment (routers, switches)
  • Telecommunications systems
  • High-performance computing
  • Data acquisition systems
  • Image processing
  • Video processing

Features:

  • High-speed clock frequency: 250 MHz
  • Synchronous operation: Aligned to a system clock for precise timing
  • 4Mb memory organization: 128K x 36 bits
  • 2.5V power supply
  • Burst operation: Supports fast data transfers
  • On-chip address counter
  • Available in various package options (e.g., BGA)

Benefits:

  • Increased system performance: High clock frequency enables faster data throughput
  • Simplified memory control: Synchronous operation streamlines timing management
  • Optimized bandwidth: Burst operation maximizes data transfer efficiency
  • Reduced power consumption: Low voltage operation minimizes power usage
  • Easy integration: Compatible with industry-standard interfaces

Additional Details:

The CY7C1414KV250BZC features a synchronous architecture, which means that all memory operations are synchronized to a common clock signal. This ensures precise timing and predictable behavior. The device supports burst operations, allowing for fast and efficient data transfers. The on-chip address counter simplifies memory access and reduces the need for external control logic. This SRAM is well-suited for applications requiring high bandwidth and low latency. The BGA (Ball Grid Array) package provides a compact footprint and excellent thermal performance. The operating temperature range can vary depending on the specific revision of the device. This SRAM is engineered for very high speed applications that rely on efficient data transfer.

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