XC7Z035-3FFG900E Real Image
Same model may have multiple batches, images only for reference.

Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 130
Base Product Number XC7Z035
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7B
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1124939-XC7Z035-3FFG900E
Ultra Librarian 3D Model Ultra Librarian XC7Z035-3FFG900E CAD Model

Description

This integrated circuit (IC) is part of the Zynq-7000 series and has the Win Source Part Number 1124939-XC7Z035-3FFG900E.

  • Core Processor: Dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Speed: 800MHz
  • Package: Tray
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA
  • I/O: 130
  • RAM Size: 256KB
  • FPGA: Kintex-7 FPGA with 275K Logic Cells
  • Architecture: MCU and FPGA
  • Package/Case: 900-BBGA, FCBGA
  • Temperature Range: 0°C ~ 100°C (TJ)
  • ECCN: 3A001A7B

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $158.1240 $158.1240
2+ $152.8532 $305.7064
3+ $137.0408 $411.1224
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 700 pieces
Order Increment : 1 piece
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