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XCV3004BGG352C

Part No XCV3004BGG352C
Manufacturer Xilinx Inc.
Catalog OEM Parts (T - Z)
Description IC FPGA 2.5V C-temp 352-MBGA
Sample
Rohs State rohs
ECAD Module
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Number of Gates 322970
RoHS Compliant
Win Source Part Number 1011670-XCV3004BGG352C
Categories OEM Parts(T-Z)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XCV3004BGG352C CAD Model

Description

The XCV3004BGG352C is a Virtex-II Pro FPGA (Field-Programmable Gate Array) manufactured by Xilinx. It is a high-performance FPGA designed for complex digital logic applications, featuring a large number of logic cells, memory blocks, and high-speed I/O interfaces. This device is part of the Virtex-II Pro family, which incorporates embedded PowerPC processors, making it suitable for embedded processing applications.

Applications

  • High-performance computing
  • Digital signal processing (DSP)
  • Embedded systems with PowerPC processors
  • Telecommunications infrastructure
  • Aerospace and defense applications

Features

  • Logic Cells: 30,000
  • Embedded PowerPC Processors
  • High-Speed I/O Interfaces (e.g., RocketIO)
  • Block RAM Memory
  • Digital Clock Managers (DCMs)
  • Package: BGG352

Benefits

  • Provides a high level of integration with a large number of logic cells and embedded processors.
  • Enables high-performance computing with fast processing speeds and efficient memory access.
  • Supports a wide range of I/O standards for flexible connectivity.
  • Facilitates complex digital signal processing algorithms.
  • Offers advanced clock management capabilities for precise timing control.

Additional Details

The XCV3004BGG352C comes in a BGG352 package. It requires a configuration PROM or other means of configuration upon power-up. The device utilizes advanced process technology for high performance and low power consumption. It supports various memory interfaces and is compatible with Xilinx development tools. This FPGA is designed for applications requiring a combination of high logic density, embedded processing capabilities, and high-speed I/O.

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