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XC3090-50PG175B

Part No XC3090-50PG175B
Manufacturer Xilinx Inc.
Catalog Custom Parts (U - Z)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1223292-XC3090-50PG175B
Categories Custom Parts
Manufacturer Xilinx Inc.
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC3090-50PG175B CAD Model

Description

The XC3090-50PG175B is a Field-Programmable Gate Array (FPGA) from Xilinx's XC3000 family. These FPGAs are designed for flexible logic implementation, offering a programmable architecture that can be configured to implement a wide range of digital circuits. The PG175 package indicates a Pin Grid Array package with 175 pins and "-50" likely relates to speed grade of 50MHz.

Applications

  • Prototyping: Used for prototyping digital designs before committing to custom silicon.
  • Industrial Control Systems: Implemented in programmable logic controllers (PLCs) and other industrial automation devices.
  • Telecommunications Equipment: Utilized in routers, switches, and other networking devices.
  • Aerospace and Defense: Employed in radar systems, communication equipment, and navigation systems.
  • Medical Imaging: Integrated into medical scanners for image processing and data acquisition.

Features

  • Configurable Logic Blocks (CLBs): The fundamental building blocks of the FPGA, providing programmable logic functions.
  • Input/Output Blocks (IOBs): Programmable input and output pins for interfacing with external devices.
  • Interconnect Resources: A network of programmable routing channels for connecting CLBs and IOBs.
  • On-Chip Memory: Integrated memory blocks for data storage and retrieval.
  • Clock Management: Circuits for generating and distributing clock signals throughout the FPGA.
  • User-Programmable: Can be programmed and reprogrammed multiple times.

Benefits

  • Flexibility: Allows designers to implement custom logic functions without the need for custom silicon.
  • Reprogrammability: Enables designers to modify the functionality of the device after it has been manufactured and deployed.
  • Time-to-Market: Reduces development time compared to traditional ASIC design.
  • Cost-Effectiveness: Provides a cost-effective solution for low-to-medium volume production.
  • High Performance: Delivers high-speed performance for demanding applications.

The XC3090-50PG175B typically requires external configuration memory to store the programming data. The device is configured by loading a bitstream into its internal memory cells, which define the connections between logic blocks and I/O pins. The operating temperature range is generally specified as industrial grade, allowing the device to function reliably in harsh environments. The device offers various I/O standards support allowing integration with a range of peripherals and communication protocols.

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