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X25320S

Part No X25320S
Manufacturer Xicor Inc.
Catalog Electronic Wholesale
Description SPI Serial E2PROM With Block LockTM Protection
Sample
Rohs State Need to verify
ECAD Module
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Manufacturer Xicor Inc.
Win Source Part Number 1280811-X25320S
Manufacturer Homepage www.xicor.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian X25320S CAD Model

Description

The X25320S is a 32 Kb Serial SPI EEProm manufactured by Xicor Inc. It is a low-power, serial Electrically Erasable Programmable Read-Only Memory (EEPROM) device. It features a Serial Peripheral Interface (SPI) for communication with a microcontroller or other SPI-compatible devices.

Applications:

  • Data storage in embedded systems
  • Configuration storage for electronic devices
  • Parameter storage for industrial control systems
  • Storage of calibration data
  • Storing user preferences in consumer electronics

Features:

  • 32 Kb (4096 x 8) Serial EEPROM
  • SPI Interface (Modes 0,0 & 1,1)
  • Low Power Operation
  • Self-Timed Write Cycle
  • Write Protect Feature
  • High Reliability
  • 8-Pin Packages

Benefits:

  • Non-volatile storage retains data even when power is removed.
  • SPI interface simplifies connection to microcontrollers.
  • Low power consumption makes it suitable for battery-powered applications.
  • Self-timed write cycle simplifies programming and reduces programming time.
  • Write protect feature prevents accidental data corruption.
  • High reliability ensures long-term data storage.

Additional Details:

The X25320S operates within a voltage range of 2.7V to 5.5V. It supports SPI modes 0,0 and 1,1. The typical write cycle time is 5 ms. The device features a software write protection and hardware write protect pin. It also includes page write capability, allowing for writing multiple bytes in a single operation. The operating temperature ranges from -40°C to +85°C.

The erase/write endurance is typically 1,000,000 cycles. The data retention is specified as greater than 100 years. The device is available in various package options including SOIC and TSSOP.

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