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Same model may have multiple batches, images only for reference.
W987D2HBJX6I Real Image
Same model may have multiple batches, images only for reference.

W987D2HBJX6I

Part No W987D2HBJX6I
Manufacturer Winbond Electronics
Catalog Memory
Description IC DRAM 128MBIT PAR 90VFBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Memory
Mfr Winbond Electronics
Package Tray
Product Status Obsolete
Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPSDR
Memory Size 128Mbit
Memory Organization 4M x 32
Memory Interface Parallel
Clock Frequency 166 MHz
Write Cycle Time - Word, Page 15ns
Access Time 5.4 ns
Voltage - Supply 1.7V ~ 1.95V
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 90-TFBGA
Supplier Device Package 90-VFBGA (8x13)
Base Product Number W987D2
Standard Package 240 pcs
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0002
Win Source Part Number 944798-W987D2HBJX6I
Ultra Librarian 3D Model Ultra Librarian W987D2HBJX6I CAD Model

Description

The Win Source Part Number 944798-W987D2HBJX6I is a mobile memory module.

  • Category: Integrated Circuits (ICs) - Memory - Memory
  • Technology: SDRAM - Mobile LPSDR
  • Memory Size: 128Mbit
  • Access Time: 5.4 ns
  • Voltage Supply: 1.7V to 1.95V
  • Mounting Type: surface mount
  • Package: 90-TFBGA
  • Operating Temperature: -40°C to 85°C
  • Clock Frequency: 166 MHz
  • Memory Interface: parallel memory interface
  • Manufacturer: Winbond Electronics W987D2HBJX6I
  • Suitability: is a reliable memory module suitable for mobile applications.

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