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W24258-70LE

Part No W24258-70LE
Manufacturer Winbond Electronics
Catalog Electronic Wholesale
Description 32K X 8 CMOS STATIC RAM
Sample
Rohs State rohs
ECAD Module
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Manufacturer Winbond Electronics
Win Source Part Number 1279984-W24258-70LE
Manufacturer Homepage www.winbond.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian W24258-70LE CAD Model

Description

The W24258-70LE is a 256K x 8 bit high-speed CMOS static RAM (SRAM) manufactured by Winbond Electronics. This memory device is designed for applications requiring fast access times and low power consumption. It's suitable for use in cache memory, buffer memory, and other high-performance applications.

Applications

  • Cache memory
  • Buffer memory
  • Embedded systems
  • Microcontroller systems
  • Networking equipment
  • Industrial control systems

Features

  • 256K x 8 bit organization
  • High-speed access time (70ns)
  • Low power consumption
  • Single 5V power supply
  • TTL compatible inputs and outputs
  • Three-state outputs
  • Data retention voltage: 2V (min)

Benefits

  • Fast data access for improved system performance
  • Low power consumption for energy-efficient operation
  • Easy integration into existing systems
  • Wide operating voltage range
  • Reliable data storage
  • Simplified circuit design

Additional Details

The W24258-70LE SRAM offers a fast access time of 70ns, enabling quick data retrieval and storage. Its low power consumption makes it suitable for battery-powered and energy-sensitive applications. The device operates from a single 5V power supply and features TTL compatible inputs and outputs for easy interfacing with other logic devices. The three-state outputs allow for bus sharing and simplified memory system design. The SRAM retains data down to a voltage of 2V, ensuring data integrity during power fluctuations. Refer to the datasheet for detailed electrical specifications, timing diagrams, and packaging information. The device is available in various package options, such as DIP (Dual In-line Package) and SOIC (Small Outline Integrated Circuit).

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