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TFDU4202-TR3

Part No TFDU4202-TR3
Manufacturer Vishay
Catalog IrDA Transceiver Modules
Description Integrated Low Profile Transceiver Module for Telecom Applications - IrDA Standard
Sample
Rohs State rohs
ECAD Module
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Category Sensors,Transducers
Family IrDA Transceiver Modules
Manufacturer Vishay
Win Source Part Number 216830-TFDU4202-TR3
Popularity Medium
Supply and Demand Status Sufficient
Ultra Librarian 3D Model Ultra Librarian TFDU4202-TR3 CAD Model

Description

The TFDU4202-TR3 is an infrared (IR) transceiver module manufactured by Vishay Semiconductors, designed for short-range wireless data communication. It is compliant with the IrDA physical layer standard. This module integrates an infrared emitter (IRED), a photodiode, and control circuitry into a single compact package, making it suitable for various applications requiring IrDA communication. This particular model supports higher data transfer rates compared to some older IrDA transceivers.

Applications:

  • IrDA data communication in mobile phones and smartphones
  • Wireless communication in laptop computers and notebooks
  • Infrared data transfer in printers and digital cameras
  • Personal Digital Assistants (PDAs)
  • Medical devices requiring wireless data exchange

Features:

  • Compliant with IrDA physical layer specification
  • Supports data rates up to 4 Mbit/s (FIR)
  • Low power consumption for extended battery life
  • Surface-mount package for easy PCB assembly
  • Integrated photodiode and IRED for simplified design
  • RoHS compliant

Benefits:

  • Enables high-speed wireless data transfer between IrDA-compatible devices
  • Easy integration into compact electronic devices
  • Prolongs battery life in portable applications
  • Reduces board space and component count
  • Provides reliable and standardized IR communication

The TFDU4202-TR3 transceiver module supports high data rates, facilitating faster data transfer compared to standard IrDA transceivers. Its low power consumption makes it ideal for battery-powered devices, prolonging their operational life. The surface-mount package allows for efficient and automated assembly on printed circuit boards, reducing manufacturing costs. The integrated components simplify the design process and minimize the need for external circuitry. The higher data rate makes it suitable for applications needing to quickly transfer files or other data wirelessly.

Technical Specifications:

  • Data Rate: Up to 4 Mbit/s (FIR)
  • Wavelength: 875 nm
  • Supply Voltage: 2.4 V to 3.6 V
  • Operating Temperature: -25 °C to +85 °C
  • Package: SMD
  • IrDA Physical Layer Compliance

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