Product Overview: SN74LVC16646ADGGR

The SN74LVC16646ADGGR is a high-performance, 16-bit bus transceiver and register designed by Texas Instruments. Crafted to operate with a 3.3V power supply, it belongs to the LVC family, which is known for low-voltage operation and high-speed interfacing. This product is particularly suitable for bidirectional communication between data buses and can be used in a variety of digital applications, including computing, networking, and telecommunication systems.

Key Features

• Wide Operating Voltage Range: The device is compatible with a voltage range of 2.7V to 3.6V, allowing for flexible integration into various low-voltage systems.
• High-Speed Data Transfer: With a maximum data rate of up to 240 Mbps, the SN74LVC16646ADGGR ensures swift data transfer between buses, which is essential for high-speed computing tasks and data-intensive applications.
• Bus-Hold Data Inputs: It eliminates the need for external pull-up or pull-down resistors, simplifying the design and reducing the bill of materials.
• Low Power Consumption: The device features a low ICC of 20 µA max, which makes it an energy-efficient choice for power-sensitive designs.
• Flow-Through Architecture: This design optimizes the PCB layout and reduces signal skew, enhancing overall system reliability and performance.

Technical Specifications

• Logic Type: Bus Transceiver with 16-Bit Directional Register
• Output Type: 3-State
• Number of Elements: 2
• Number of Bits per Element: 8
• Mounting Type: Surface Mount
• Package / Case: 48-TSSOP (0.240", 6.10mm Width)
• Operating Temperature: -40°C to 85°C

Applications

The SN74LVC16646ADGGR is designed to be used in a broad range of applications including memory interleaving, data buffering, and bus matching in servers, desktops, laptops, and other advanced computing devices. Its high-speed performance and low-power operation also make it suitable for portable and battery-operated equipment.

Ordering and Packaging

Each SN74LVC16646ADGGR comes in a TSSOP (Thin Shrink Small Outline Package) form factor, which is ideal for space-constrained applications. The device is provided in tape and reel packaging, which facilitates automated assembly processes for high-volume production.

For detailed technical documentation, application notes, and support, visit the Texas Instruments official website or contact their customer support team.