The SN74AC563DWRG4 is a high-performance integrated circuit from Texas Instruments designed to provide efficient and reliable solutions for a wide range of digital storage applications. This device belongs to the 74AC series and is an octal D-type transparent latch with three-state outputs.

Key Features

• Logic Type: Octal D-Type Transparent Latch
• Output Type: 3-State
• Number of Bits per Element: 8
• Operating Temperature: -40°C to 85°C
• Mounting Type: Surface Mount
• Package / Case: SOIC-20
• Propagation Delay Time: 4.5ns at 5V, 50pF
• Supply Voltage: 2V to 6V

Product Description

The SN74AC563DWRG4 is specifically designed for the temporary storage of data. It operates as an octal transparent latch where the state of each D-type latch is determined by the level of the corresponding D input and the latch enable (LE) input. When LE is high, the Q outputs will follow the D inputs. When LE is taken low, the Q outputs will be latched at the levels that were set up at the D inputs before the high-to-low transition of LE.

Featuring three-state outputs, this device can be connected directly to a bus-organized system. The outputs can be placed in either a high-impedance state or a logic state, allowing for greater flexibility in bus management and control. This makes the SN74AC563DWRG4 ideal for interfacing with bus lines in a bus-organized system without the need for external pull-up components.

The SN74AC563DWRG4 is fabricated using Texas Instruments' advanced Schottky technology, which provides high speed and low power consumption. This technology, combined with the device's wide operating voltage range and the ability to drive up to 24mA at the outputs, makes it suitable for interfacing with high-speed microprocessors and can be used in a variety of applications such as data storage, buffer memory, and peripheral drivers.

Available in a compact SOIC-20 package, the SN74AC563DWRG4 is designed for surface mount applications and is fully specified for hot-insertion and wave soldering processes, making it suitable for complex, multi-layer PCBs used in modern electronic assemblies.