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C5750X7R1E106MT020U

Part No C5750X7R1E106MT020U
Manufacturer TDK Corporation
Catalog OEM Parts (C - E)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS Non-Compliant
Win Source Part Number 996412-C5750X7R1E106MT020U
Categories OEM Parts(C-E)
Manufacturer TDK Corporation
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian C5750X7R1E106MT020U CAD Model

Description

The C5750X7R1E106MT020U is a multi-layer ceramic capacitor (MLCC) manufactured by TDK Corporation. MLCCs are widely used in electronic circuits for decoupling, bypassing, filtering, and energy storage.

Applications:

  • Power supply decoupling
  • Bypass capacitors in digital circuits
  • Filtering in analog circuits
  • Smoothing capacitors in power supplies
  • Noise reduction in sensitive circuits

Features:

  • X7R dielectric, providing stable performance over temperature
  • High capacitance value (10µF) for effective decoupling and filtering
  • Surface mount device (SMD) for automated assembly
  • Low equivalent series resistance (ESR) for minimal power loss
  • High reliability and long lifespan
  • RoHS compliant, meeting environmental standards

Benefits:

  • Improved signal integrity in electronic circuits
  • Stable performance in varying temperature conditions
  • Reduced board space due to compact SMD package
  • Enhanced system reliability with high-quality components
  • Simplified assembly process with SMD technology

Additional Details:

MLCCs are constructed from alternating layers of ceramic dielectric and metal electrodes. The C5750X7R1E106MT020U utilizes an X7R dielectric, offering stable capacitance over a temperature range of -55°C to +125°C. The capacitance value is 10µF with a tolerance (indicated by 'M') of ±20%. The voltage rating (indicated by '1E') is 25V. The case size is 2220 (5.7mm x 5.0mm). The ESR and ESL are critical parameters, especially in high-frequency applications. The manufacturer's datasheet contains detailed specifications, including impedance vs. frequency curves, temperature coefficient of capacitance, and insulation resistance. Careful handling and soldering techniques are essential to avoid mechanical stress and ensure reliable performance. Proper placement and routing on the PCB are also important to minimize parasitic inductance and optimize decoupling effectiveness.

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