The SUB-DSM-590-E-09-S-S is a high-density, surface mount connector from Samtec's DSM series. It is designed for board-to-board connections requiring a compact footprint and reliable signal transmission.

Applications

• High-speed data transmission systems
• Medical equipment
• Industrial automation
• Telecommunications infrastructure
• Test and measurement equipment

Features

• High-density design with a small form factor
• Surface mount termination for automated assembly
• Durable construction for reliable performance
• Robust mating interface
• Available in various pin counts and stack heights

Benefits

• Enables compact and space-saving designs
• Facilitates efficient manufacturing processes
• Ensures reliable signal integrity in demanding applications
• Provides a secure and stable connection
• Offers design flexibility with a range of options

Additional Details

Specifically, the SUB-DSM-590-E-09-S-S features a surface mount termination style. It is typically used for parallel board stacking applications. The connector's design minimizes impedance discontinuities, thereby optimizing signal integrity. Samtec connectors are known for their precision manufacturing and high-quality materials, ensuring long-term reliability. This particular model is commonly employed in systems where minimizing board space is a key requirement.

The connector is often gold-plated to ensure optimal conductivity and resistance to corrosion, crucial for maintaining signal integrity over extended periods. Its compact size allows for placement in close proximity to other components, further enhancing board utilization. Furthermore, the robust construction ensures that the connector can withstand mechanical stresses commonly encountered in various applications. Proper mounting and soldering techniques are recommended to ensure optimal performance and long-term reliability of the connection. The part number indicates specific characteristics like the number of contacts, plating material and connector body style.