The SFSD-03-28-G-06.50-DR-NDX is a compact, high-density socket strip from Samtec's SFSD series. It's designed for board-to-board connections with a 0.050" (1.27 mm) pitch. This particular model features only 3 positions, making it ideal for applications with limited space or low signal requirements. The 'G' indicates gold plating on the contacts for superior conductivity and corrosion resistance. The '06.50' refers to the stack height in millimeters. The 'DR' signifies a double row configuration, and 'NDX' typically represents a non-standard option or a customer-specific modification, potentially related to packaging or manufacturing processes.
Applications
- Low pin count board-to-board connections in electronic devices.
- Signal routing in compact systems where only a few signals need to be connected.
- Prototyping and testing of circuits.
- Small form-factor electronic products.
Features
- 0.050" (1.27 mm) pitch enables high-density interconnects.
- 3 positions.
- Gold-plated contacts for excellent electrical performance and durability.
- Through-hole termination for a robust mechanical connection to the PCB.
Benefits
- Enables compact and space-saving designs in electronic assemblies.
- Provides reliable signal transmission with gold-plated contacts.
- Ensures long-term performance and reliability in demanding environments.
- Offers a secure and stable connection to the PCB.
Additional Details
The SFSD series is known for its robust construction and high-performance capabilities. The gold plating ensures low contact resistance and excellent resistance to corrosion, making it suitable for demanding environments. The 'NDX' designator often indicates a specific customer requirement or an internal Samtec specification related to packaging or specialized manufacturing. Mating connectors are typically terminal strips from the same SFSD series or a compatible series with the same pitch and number of positions. The 3-position configuration is ideal where space is at a premium and only a few signal lines are needed.