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Same model may have multiple batches, images only for reference.
BR93G56FVJ-3BGTE2 Real Image
Same model may have multiple batches, images only for reference.

BR93G56FVJ-3BGTE2

Part No BR93G56FVJ-3BGTE2
Manufacturer Rohm Semiconductor
Catalog EEPROM
Description IC EEPROM 2K SPI 3MHZ 8TSSOP
Datasheet
BR93G56FVJ-3BGTE2 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features EEPROM Memory IC 2Kb (128 x 16) SPI 3 MHz 8-TSSOP-BJ
Manufacturer Rohm Semiconductor
Package Reel - TR
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Case / Package 8-TSSOP-BJ
Family Name BR93G56
MSL Level 1 (Unlimited)
ECCN EAR99
HTSUS 8542.32.0051
Other Part Number 846-BR93G56FVJ-3BGTE2TR, BR93G56FVJ-3BGTE2CT, BR93G56FVJ-3BG2DKR, BR93G56FVJ-3BGTE2TR, BR93G56FVJ-3BGTE2DKR, BR93G56FVJ-3BG2CT, BR93G56FVJ-3BGTE2DKR-ND, BR93G56FVJ-3BG2TR, BR93G56FVJ-3BGTE2CT-ND, BR93G56FVJ-3BGTE2TR-ND
Quantity per package 2500
Popularity High
Supply and Demand Status Balance
Win Source Part Number 913544-BR93G56FVJ-3BGTE2
Ultra Librarian 3D Model Ultra Librarian BR93G56FVJ-3BGTE2 CAD Model

Description

The Rohm Semiconductor BR93G56FVJ-3BGTE2 is an EEPROM Memory IC that has a capacity of 2Kb (128 x 16).

  • Interface: SPI 3 MHz
  • Package: 8-TSSOP
  • Temperature Range: -40°C to 85°C
  • Family: BR93G56
  • Application: Integrated Circuit Applications
  • Package Type: reel - TR
  • Quantity per Package: 2500
  • Device Demand: High
  • Estimated Production Lead Time: 51 weeks

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