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HD74HC139FP-TR

Part No HD74HC139FP-TR
Manufacturer Renesas Electronics America
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1062292-HD74HC139FP-TR
Categories OEM Parts(F-I)
Manufacturer Renesas Electronics America
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian HD74HC139FP-TR CAD Model

Description

The HD74HC139FP-TR is a high-speed CMOS dual 2-to-4 line decoder/demultiplexer manufactured by Renesas Electronics America. It utilizes silicon gate CMOS technology to achieve high-speed performance with low power consumption. The device contains two independent 2-to-4 line decoders. Each decoder has two address inputs (A0, A1) and an enable input (E). When the enable input is high, all outputs are forced high.

Applications

  • Memory chip selection
  • Address decoding
  • Logic level translation
  • Data routing and distribution
  • Instrumentation and control systems

Features

  • High Speed: tpd = 13 ns (typ.) at VCC = 5V
  • Low power dissipation: ICC = 4 μA (max.) at Ta = 25°C
  • High noise immunity: VNIH = VNIL = 28% VCC (min.)
  • Output drive capability: 10 LSTTL loads
  • Cascadable for larger decoding functions
  • Wide operating voltage range: 2V to 6V
  • Temperature range: -40°C to +85°C
  • Package: SOP-16 (Small Outline Package)

Benefits

  • Efficient memory addressing due to the dual 2-to-4 line decoding capability.
  • Reduced power consumption compared to TTL logic, suitable for battery-powered applications.
  • Simplified system design due to high noise immunity.
  • Easy cascading for larger decoding applications.
  • Versatile application due to wide operating voltage range.

Additional Details

The HD74HC139FP-TR offers a propagation delay of typically 13 ns at 5V, allowing for high-speed operation in digital circuits. Its output drive capability is sufficient for driving up to 10 LSTTL loads. The device is designed to operate from -40°C to +85°C, making it suitable for industrial and automotive applications. The SOP-16 package provides a compact footprint for high-density board layouts. The outputs are active-low.

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