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74LVC574APW

Part No 74LVC574APW
Manufacturer NXP / Nexperia
Catalog Hard To Find
Description Octal D-type flip-flop with 5-volt tolerant inputs/outputs; positive edge-trigger 3-State
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Manufacturer NXP
Win Source Part Number 1133015-74LVC574APW
Manufacturer Homepage www.nxp.com
Popularity Medium
Supply and Demand Status Sufficient
Ultra Librarian 3D Model Ultra Librarian 74LVC574APW CAD Model

Description

The 74LVC574APW is a high-performance, octal D-type flip-flop with a clear function, manufactured by NXP Semiconductors. This integrated circuit (IC) is part of the LVC family, which stands for Low Voltage CMOS, indicating that it operates with a low power supply voltage. It is designed to have a wide voltage range of 1.2V to 3.6V, making it suitable for interfacing with both 3.3V and 2.5V logic levels, and ensuring compatibility with a variety of modern microcontrollers and digital systems.

Key Features

  • Logic Type: Octal D-type flip-flop
  • Logic Family: LVC
  • Output Type: Tri-State Non-Inverted
  • Supply Voltage Range: 1.2V to 3.6V
  • IC Output Current: -24mA / 24mA
  • Propagation Delay Time: 3.7ns at 3.3V
  • Operating Temperature Range: -40°C to +125°C
  • Package Type: TSSOP
  • Pin Count: 20
  • Mounting Type: Surface Mount

Performance and Applications

The 74LVC574APW is designed for high-speed performance, featuring a fast propagation delay time, which makes it ideal for high-frequency operation in data storage and transfer applications. The octal D-type flip-flop is edge-triggered, capturing data on the rising edge of the clock signal, and the tri-state outputs ensure that multiple devices can be connected to a common bus without interference.

This IC is commonly used in applications that require temporary storage of data, such as in registers, buffers, and data storage devices. Its low power consumption and wide operating temperature range make it suitable for use in battery-powered devices and industrial applications that may be exposed to extreme temperatures.

The 74LVC574APW comes in a thin shrink small outline package (TSSOP), which is ideal for space-constrained applications. Its surface mount design allows for efficient assembly in high-volume production, and the device's robust construction ensures reliability and longevity in the field.

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Pricing & Ordering

Quantity Unit Price Ext. Price
255+ $0.1997 $50.9235
540+ $0.1869 $100.9260
835+ $0.1804 $150.6340
1,195+ $0.1675 $200.1625
1,555+ $0.1611 $250.5105
1,940+ $0.1547 $300.1180
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 22,500 pieces
MOQ: 255 pcs
Order Increment : 1 pcs
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