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Manufacturer NXP
Win Source Part Number 1130265-74ABT823D
Manufacturer Homepage www.nxp.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian 74ABT823D CAD Model

Description

NXP 74ABT823D Octal D-Type Flip-Flop

The NXP 74ABT823D is a high-performance, octal D-type flip-flop with 3-state outputs. Designed for use in applications requiring the capture and storage of data, this integrated circuit is a vital component in digital systems where data synchronization and storage are crucial. Manufactured by NXP Semiconductors, a leader in the industry, the 74ABT823D is built for speed and reliability.

This device features eight edge-triggered, D-type flip-flops with individual D inputs and O outputs. The flip-flops capture data on the rising edge of the clock, allowing for precise data synchronization. Each flip-flop has an independent clear input (CLR) and clock input (CP), providing flexibility in system design and enabling asynchronous clearing of the flip-flops when necessary.

The 74ABT823D is equipped with 3-state outputs, which can be placed in a high impedance state. This feature is particularly useful for shared data bus configurations, as it allows multiple devices to connect to the same bus without interference. When the output enable (OE) input is high, the device's outputs assume a high impedance state, effectively disconnecting them from the bus.

Key features of the NXP 74ABT823D include:

  • Eight D-type flip-flops with single-rail outputs
  • Fast propagation delay and clock-to-output times
  • Independent clear and clock inputs for each flip-flop
  • 3-state outputs for bus-oriented applications
  • Live insertion and extraction permitted
  • Power-up 3-state
  • Multiple package options

With its robust construction and advanced features, the NXP 74ABT823D is suitable for a wide range of applications, including:

  • Bus interface/storage
  • Data communication systems
  • Data processing
  • Industrial control systems

The device is offered in a 24-pin plastic SO package, ensuring compatibility with standard surface-mount processes and providing a compact solution for space-constrained applications.

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