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APA300-BG456M

Part No APA300-BG456M
Manufacturer Microsemi Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 290 I/O 456BGA / FPGA ProASICPLUS Family 300K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA Tray
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Sample
Rohs State Need to verify
ECAD Module
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Categories Integrated Circuits (ICs)
Manufacturer Microsemi Corporation
Series ProASICPLUS
Total RAM Bits 73728
Number of I/O 290
Number of Gates 300000
Operating Supply Voltage 2.3 V ~ 2.7 V
Mounting SMD
Operating Temperature Range -55°C ~ 125°C (TC)
Package 456-BBGA
Manufacturer Package 456-PBGA (35x35)
Win Source Part Number 768638-APA300-BG456M
Popularity Medium
Supply and Demand Status Limited
Family Name APA300
Introduction Date August 25, 2003
ECCN 3A001.a.7.a
Estimated EOL Date 2025
Ultra Librarian 3D Model Ultra Librarian APA300-BG456M CAD Model

Description

The Microsemi Corporation APA300 series ProASICPLUS electronic component is a high-performance integrated circuit (IC) designed for use in a variety of applications.

  • Operating Temperature: -55°C to 125°C (TC)
  • Package: 456-BBGA
  • Mounting: SMD
  • Operating Supply Voltage: 2.3 V to 2.7 V
  • I/Os: 290
  • Total RAM Bits: 73728
  • Gates: 300000
  • Family Name: APA300
  • Supply and Demand: Limited

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1+ $536.2500 $536.2500
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Availability: 18 pieces
Order Increment : 1 pcs
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