The PIC16F676T-I/ST is a versatile 8-bit microcontroller from Microchip Technology, designed for embedded applications requiring a compact and power-efficient solution. This microcontroller is part of the renowned PIC16F family, which is highly regarded for its ease of use, reliability, and flexibility in various electronic applications.

Key Features

• High-Performance RISC CPU: Features a Reduced Instruction Set Computing (RISC) architecture that enables the execution of most instructions in a single cycle, improving overall performance.
• Flash Memory: Equipped with 1.75 KB of flash memory, providing ample space for application code and allowing for easy reprogramming and updates.
• RAM and EEPROM: Comes with 64 bytes of RAM for data processing and 128 bytes of EEPROM for non-volatile data storage.
• I/O Pins: Offers 12 versatile input/output pins, which can be configured for various interface requirements.
• Analog-to-Digital Converter (ADC): Includes a 10-bit ADC with up to 8 channels, enabling the microcontroller to interface with analog sensors and convert their signals into digital values.
• Timer Modules: Contains two timer modules that can be used for timing operations, pulse generation, or as counters.
• In-Circuit Serial Programming™ (ICSP™): Supports ICSP for convenient programming and reprogramming of the microcontroller without removing it from the circuit.
• Wide Operating Voltage: Functions within a range of 2.0V to 5.5V, making it suitable for battery-operated and low-power applications.
• Temperature Range: Operates within an industrial temperature range of -40°C to +85°C, ensuring reliability under extreme conditions.

Applications

The PIC16F676T-I/ST is ideal for a broad range of applications, including but not limited to consumer electronics, automotive systems, industrial controls, and battery-powered devices. Its robust feature set enables designers to implement complex functions while minimizing space and power requirements.

Package Information

This microcontroller is available in a TSSOP-14 package, providing a compact footprint that is suitable for space-constrained applications. The surface-mount technology (SMT) package allows for efficient assembly and integration into printed circuit boards (PCBs).