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AX2000-2FG896I

Part No AX2000-2FG896I
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 586 I/O 896FBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 3 Weeks
Features series Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
Manufacturer Microchip Technology
Series Axcelerator
Package Tray
Number of I/O 586
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 896-BGA
Case / Package 896-FBGA (31x31)
Family Name AX2000
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7A
HTSUS 8542.39.0001
Quantity per package 27
Popularity High
Supply and Demand Status Balance
Win Source Part Number 912315-AX2000-2FG896I
Ultra Librarian 3D Model Ultra Librarian AX2000-2FG896I CAD Model

Description

The AX2000-2FG896I is a high-performance, feature-rich component from Microchip Technology, a leading provider of smart, connected, and secure embedded control solutions. This product is designed to cater to a wide range of applications, including industrial automation, automotive systems, consumer electronics, and communication infrastructure.

Key Features

  • Advanced Processing Capabilities: At the heart of the AX2000-2FG896I is a powerful processing unit that enables efficient handling of complex algorithms and tasks, ensuring smooth operation even in demanding applications.
  • Robust Security Features: Security is a top priority in today's connected world, and this product comes equipped with advanced security measures to protect against unauthorized access and ensure data integrity.
  • High Connectivity: The AX2000-2FG896I boasts a range of connectivity options, providing flexibility in system design and ensuring compatibility with various peripherals and interfaces.
  • Energy Efficiency: Microchip Technology understands the importance of energy conservation, which is why this product is engineered to be as energy-efficient as possible, reducing power consumption and heat generation.
  • Durability: Designed to withstand harsh environments, the AX2000-2FG896I can operate reliably under extreme temperatures and conditions, making it suitable for industrial-grade applications.
  • Package Type: The device comes in a 896-pin BGA (Ball Grid Array) package, which allows for a compact footprint and efficient use of space on printed circuit boards (PCBs).

Applications

The versatility of the AX2000-2FG896I makes it ideal for a multitude of applications. It is particularly well-suited for:

  • Automotive control units
  • Industrial automation systems
  • Smart home devices
  • Internet of Things (IoT) endpoints
  • Telecommunication infrastructure

Product Quality and Support

Microchip Technology is committed to providing customers with high-quality products and comprehensive support. The AX2000-2FG896I is backed by rigorous testing and validation processes to ensure it meets the highest standards of reliability and performance. Additionally, customers can access extensive documentation, development tools, and a supportive community for assistance in integrating this product into their designs.

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