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A2F200M3F-FGG256

Part No A2F200M3F-FGG256
Manufacturer Microchip Technology
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 80MHZ 256FBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 37 Weeks
Features ARM® Cortex®-M3 System On Chip (SOC) IC series ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 256-FPBGA (17x17)
Manufacturer Microchip Technology
Series SmartFusion®
Package Tray
Core Processor ARM® Cortex®-M3
Speed 80MHz
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals DMA, POR, WDT
Number of I/O MCU - 25, FPGA - 66
Operating Temperature Range 0°C ~ 85°C (TJ)
Package 256-LBGA
Case / Package 256-FPBGA (17x17)
Family Name A2F200
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Part Number 1100-1003, A2F200M3FFGG256
Quantity per package 1
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 858877-A2F200M3F-FGG256
Ultra Librarian 3D Model Ultra Librarian A2F200M3F-FGG256 CAD Model

Description

Product Overview: A2F200M3F-FGG256 from Microchip Technology

The A2F200M3F-FGG256 is a state-of-the-art field-programmable gate array (FPGA) developed by Microchip Technology, a leader in the field of smart, connected, and secure embedded control solutions. Designed to deliver high-performance, flexibility, and cost-effectiveness, this FPGA is an ideal choice for a wide range of applications, from consumer electronics to industrial automation systems.

At the heart of the A2F200M3F-FGG256 is its advanced 200K logic element architecture, which provides the computational power and speed necessary for complex digital signal processing, data management, and control tasks. The logic elements are complemented by a rich set of features, including embedded memory blocks, digital signal processing (DSP) blocks, and a versatile set of I/O options, allowing designers to tailor the FPGA to their specific application requirements.

Key Features:

  • Logic Elements: The device boasts 200,000 logic elements, offering ample resources for implementing intricate designs.
  • Memory: Integrated memory blocks facilitate efficient data storage and retrieval, essential for high-speed data processing tasks.
  • DSP Blocks: Dedicated DSP blocks enable efficient implementation of arithmetic-intensive functions, which are crucial for applications like image processing and digital communication.
  • I/O Versatility: A wide variety of I/O standards are supported, allowing for flexible interfacing with other devices and systems.
  • Package: The device comes in a Fine-pitch Grid Array (FGG256) package, ensuring a compact footprint for space-constrained applications.

The A2F200M3F-FGG256 also emphasizes ease of use with its comprehensive development tools and software support. These tools simplify the design process, from initial concept to final product, and help reduce time-to-market. Additionally, the FPGA's low power consumption makes it an eco-friendly choice for energy-sensitive designs.

Whether you're designing cutting-edge consumer electronics, sophisticated industrial control systems, or innovative communication devices, the A2F200M3F-FGG256 from Microchip Technology offers the performance, flexibility, and reliability you need to bring your visions to life.

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