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Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU5
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Win Source Part Number 1353770-XCZU5CG-L2FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU5CG-L2FBVB900E CAD Model

Description

The XCZU5CG-L2FBVB900E is an active integrated circuit (IC) from the Zynq UltraScale+ MPSoC CG series by AMD.

  • Type: System on Chip (SoC)
  • Application: Embedded Applications
  • Operating Temperature: 0°C to 100°C
  • MSL Level: 4 (72 hours)
  • Package Type: Tray
  • Package/Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • Base Product Number: XCZU5
  • Speed: 533MHz and 1.3GHz
  • Number of I/Os: 204
  • Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight and dual ARM Cortex-R5 with CoreSight
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • RAM Size: 256KB
  • Architecture: MCU and FPGA

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