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XC7Z045-1FFG676I

Part No XC7Z045-1FFG676I
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 676FCBGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 350K Logic Cells 667MHz 676-FCBGA (27x27)
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ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z045
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1195353-XC7Z045-1FFG676I
Ultra Librarian 3D Model Ultra Librarian XC7Z045-1FFG676I CAD Model

Description

The XC7Z045-1FFG676I is an integrated circuit of the Zynq-7000 series manufactured by AMD.

  • Win Source Part Number: 1195353-XC7Z045-1FFG676I
  • SoC Processor: dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Processor Speed: 667MHz
  • Package: tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA
  • I/Os: 130
  • RAM Size: 256KB
  • Flash Size: None
  • Architecture: MCU and FPGA
  • Primary Attributes: Kintex-7 FPGA and 350K logic cells
  • Package/Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
  • Operating Temperature Range: -40°C to 100°C (TJ)
  • MSL Level: 4 (72 hours)
  • REACH Status: REACH unaffected
  • HTSUS: 8542.39.0001
  • Manufactured by: AMD Xilinx

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $150.9091 $150.9091
2+ $145.1049 $290.2098
3+ $139.3007 $417.9021
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Availability: 500 pieces
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