The SS33B2035 is a surface mount EMI shielding clip manufactured by Leader Tech Inc. These clips are designed to provide a secure and reliable grounding connection between a PCB and a metal chassis or shield. They are a cost-effective solution for improving EMI/RFI shielding performance in electronic devices.

Applications

• Printed Circuit Boards (PCBs) requiring EMI/RFI shielding
• Electronic enclosures and chassis needing grounding connections
• Telecommunications equipment
• Medical devices
• Consumer electronics
• Automotive electronics

Features

• Surface mount design for easy PCB assembly
• Beryllium Copper (BeCu) material for high conductivity and spring force
• Excellent EMI/RFI shielding performance
• Low profile design
• High reliability and durability
• RoHS compliant

Benefits

• Improved EMI/RFI shielding effectiveness, reducing electromagnetic interference
• Simplified PCB assembly process
• Reduced component count compared to traditional grounding methods
• Cost-effective solution for EMI/RFI mitigation
• Enhanced product reliability and performance
• Secure and reliable grounding connection

Additional Details

The SS33B2035 clip is made from Beryllium Copper, known for its excellent spring properties, high electrical conductivity, and resistance to corrosion. The surface mount design allows for automated placement on the PCB, reducing assembly time and cost. These clips are designed to provide a low impedance path to ground, effectively shunting unwanted electromagnetic energy away from sensitive circuitry. They are typically used in conjunction with metal enclosures or shields to create a Faraday cage effect, minimizing EMI/RFI emissions and susceptibility. Proper installation is crucial for optimal performance; the clip must make good contact with both the PCB ground plane and the metal chassis or shield.