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CGY180E6327

Part No CGY180E6327
Manufacturer Infineon Technologies
Catalog OEM Parts (C - E)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 994602-CGY180E6327
Categories OEM Parts(C-E)
Manufacturer Infineon Technologies
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian CGY180E6327 CAD Model

Description

The CGY180E6327 is a discrete Gallium Nitride on Silicon Carbide (GaN-on-SiC) High Electron Mobility Transistor (HEMT) from Infineon Technologies. This transistor is designed for high-efficiency power amplification in various applications. It leverages the superior material properties of GaN to offer excellent performance at microwave frequencies.

Applications:

  • Radar Systems: Used in the power amplifier stages of radar transmitters.
  • Communication Systems: Suitable for base station power amplifiers and satellite communication systems.
  • Industrial Heating: Can be used in solid-state RF heating applications.
  • Test and Measurement Equipment: Employed in signal generators and power amplifiers for testing purposes.

Features:

  • GaN-on-SiC Technology: Provides high breakdown voltage and high-temperature operation.
  • High Power Gain: Offers significant signal amplification.
  • High Efficiency: Minimizes power consumption and heat dissipation.
  • Wide Bandwidth: Suitable for applications requiring a broad frequency range.
  • Robustness: Designed to withstand high voltage and current levels.

Benefits:

  • Improved System Performance: Enables higher power output and efficiency in RF systems.
  • Reduced Size and Weight: GaN technology allows for smaller and lighter amplifier designs.
  • Lower Operating Costs: High efficiency translates to reduced power consumption and cooling requirements.
  • Increased Reliability: Robust design ensures stable and long-term operation.
  • Simplified System Design: High gain simplifies amplifier design and reduces component count.

Additional Details:

The CGY180E6327 is typically supplied in a flange or bolt-down package for efficient heat dissipation. Its electrical characteristics, such as gain, output power, and efficiency, are specified in the datasheet provided by Infineon. The device is designed to operate at specific voltage and current levels, and proper biasing is essential for optimal performance. GaN HEMTs are more sensitive to electrostatic discharge (ESD) than silicon devices, so appropriate handling precautions are necessary.

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