The CL321611T-8R2K-N is a wire-wound chip inductor manufactured by Chilisin. This inductor is designed for a variety of high-frequency applications requiring specific inductance and impedance characteristics. Its small size makes it suitable for compact electronic devices where board space is at a premium.
Applications
- RF Circuits: Used in radio frequency circuits for impedance matching, filtering, and signal tuning.
- Wireless Communication: Found in Bluetooth devices, Wi-Fi modules, and other wireless communication systems.
- Mobile Devices: Employed in smartphones, tablets, and other portable devices for RF signal processing.
- Networking Equipment: Utilized in routers, switches, and modems for signal conditioning and impedance matching.
- Power Amplifiers: Used in power amplifier circuits for impedance matching and filtering.
Features
- Wire-Wound Construction: Provides high Q-factor and excellent self-resonant frequency (SRF) characteristics.
- 8.2μH Inductance: Offers a specific inductance value tailored for various high-frequency applications.
- High Current Handling: Can handle relatively high currents without saturation, ensuring stable performance.
- Surface Mount Technology (SMT): Designed for automated assembly processes, ensuring precise and consistent placement on printed circuit boards.
- Compact Size: The 3216 (1206) package size allows for high-density mounting on printed circuit boards, saving valuable space.
Benefits
- High Performance: Wire-wound construction provides a high Q-factor and excellent SRF, enhancing circuit performance.
- Stable Inductance: The 8.2μH inductance value remains stable over a wide range of frequencies and temperatures.
- Reliable Operation: High current handling capability ensures stable operation in demanding applications.
- Automated Assembly: SMT compatibility facilitates automated assembly processes, reducing manufacturing costs.
- Space Efficiency: The compact size is ideal for applications where board space is limited.
Additional Details
The CL321611T-8R2K-N inductor is typically constructed with a ceramic core and a shielded design to minimize electromagnetic interference (EMI). Detailed specifications include DC resistance (DCR), self-resonant frequency (SRF), and quality factor (Q). Proper soldering techniques and reflow profiles are crucial for ensuring reliable connections and optimal performance. Refer to the Chilisin datasheet for complete specifications, application guidelines, and recommended soldering profiles. The "N" suffix likely indicates a specific tolerance or packaging detail; consult the datasheet for clarification.