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XCZU47DR-2FFVE1156I

Part No XCZU47DR-2FFVE1156I
Manufacturer Amd
Catalog OEM Souring
Description FPGA Zynq UltraScale+ RFSoCs 1156-BGA
Sample
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ECAD Module
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Category OEM Souring
Win Source Part Number 1463402-XCZU47DR-2FFVE1156I
Manufacturer Amd
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.333GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Ultra Librarian 3D Model Ultra Librarian XCZU47DR-2FFVE1156I CAD Model

Description

The XCZU47DR-2FFVE1156I by AMD/Xilinx is a highly advanced field-programmable gate array (FPGA) that is part of the cutting-edge Zynq UltraScale+ RFSoC family. It combines the flexibility of FPGA programmability with the processing power of a multi-core ARM Cortex processor, integrated with RF-class analog technology. This integration makes it incredibly well-suited for applications in wireless communications, radar, and signal processing, where high data processing capabilities and RF performance are critical. The device offers a comprehensive solution for developing high-performance, integrated RF systems with reduced footprint and power consumption. Its 1156-ball BGA package ensures substantial I/O capacity and high-speed transceiver access, providing a versatile platform for system-on-chip (SoC) designs. AMD/Xilinx's XCZU47DR-2FFVE1156I represents the forefront of FPGA technology, enabling engineers to design highly efficient, integrated RF and digital systems.

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Availability: 434 pieces
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